Next Generation Microelectronics Design and Enhanced Security Service

The government authority located in Washington, DC is seeking next generation microelectronics design and enhanced security services. Many national security systems require microelectronics with some level of radiation resilience or hardness. The agency is trying to solve the vulnerability of these systems by developing integration approaches that simultaneously result in resilience to ionizing radiation and enhanced security. The scope of work covers the development of next generation microelectronics design and integration approaches. The agency encourages the development of technologies to obfuscate both function and resilience to radiation, as well as proposals that include embedded sensors for environmental, state of health, and tamper monitoring. Bidders must provide an assessment of the technical readiness of the technology and its potential applicability to defense, critical infrastructure, and commercial markets. The project also requires a quantitative analysis of the approach highlighting how progress will be measured. Only organizations from the United States are eligible to bid on this opportunity. The selected contractor will perform all work offsite. The agency is currently looking for proposals and has not disclosed a specific budget, nor have they provided key dates in the source documentation.