Microelectronics Sourcing Capability for Tobyhanna Army Depot (RFI 2)
- Client
- Department of Defense · U.S. Army
- RFP Number
- —
- Posted
- 10/9/2026
- Category
- US Federal
- Budget
- —
- NAICS
- 334413
- Set-aside
- No Set aside used
- Contact
- Mark Buonomo
Description
AI GeneratedThe U.S. Army Contracting Command issues this Request for Information for market research to identify qualified Original Component Manufacturers and Tier-1 direct distributors capable of supplying commercial-off-the-shelf, industrial, and defense-grade microelectronics. The buyer needs to transition from broker-dependent procurement models to long-term direct relationships to supply Circuit Card Assembly integration for Tobyhanna Army Depot. The requested scope includes sustained, high-volume production of active, passive, and power-management components—such as capacitors, resistors, microcontrollers, and inductors—ranging from hundreds of thousands to multi-million-unit annual runs. Eligible respondents are Original Component Manufacturers, Integrated Device Manufacturers, and direct authorized or franchised global manufacturer distributors operating under NAICS codes 334413 or 334419. Interested sources must submit a capability package of up to five pages in searchable PDF format by October 27, 2026, to Technical POC Ryan Kinger at [email protected]. Responses must address corporate profiles, supply tier classifications, manufacturing capacity, lead times, geographic assembly locations, and interest in a potential Industry/Vendor Day. This notice is strictly for planning purposes and does not constitute a solicitation or contract award.
Key solicitation details
AI-extracted from Attachment 1 - Request for Information Microelectronics Sourcing.docx. Confirm against the original documents before bidding.
The Department of the Army, Army Contracting Command is seeking market information to identify Original Component Manufacturers and Tier-1 direct distributors capable of supplying microelectronics. Deliverables include COTS, industrial, and defense-grade microelectronics in sustained production volumes ranging from hundreds of thousands to multi-million units for Circuit Card Assembly integration at Tobyhanna Army Depot. Qualified primary component fabricators and direct supp…
- Issued by
- Department of the Army, Army Contracting Command (ACC)
- Proposals due
- October 27th, 2026
- How to submit
- Electronic
- Submission details
- Submitted in searchable PDF format, not exceeding 5 pages excluding cover page and appendices, standard 12-point font and 1-inch margins.
- Place of performance
- Tobyhanna Army Depot (TYAD)
- Funding
- NDAA, DoDI 5200.50, DFARS 252.246-7007, DFARS 252.246-7008
Scope of work
- Multilayer Ceramic Capacitors (MLCC)
- Precision and Current Sense Resistors
- Power Management and Regulation (PMIC)
- Power MOSFETs and Discrete Diodes
- Microcontrollers and Digital ICs
- Inductors and High-Reliability Interconnects
- Vendor-Managed Inventory and buffer stocks
- Chain of custody and traceability documentation
Minimum qualifications
- Original Component Manufacturers (OCMs) or Tier-1 direct distributors
- Capacity for dedicated production line volume and Vendor-Managed Inventory
- ISO 9001, AS9100, or IATF 16949 quality systems
Documents to include with the bid
- Capability package including Corporate Profile and Supply Tier Classification
- Summary of Manufacturing Capacity and Component Availability
- Vendor Day attendance feedback
Official SAM.gov notice
- Solicitation number
- MicroelectronicsSourcingforTYAD2
- Agency
- Department of Defense
- Buying office
- Dept of the Army › W0ML USA DEP Tobyhanna
- Notice type
- Sources Sought
- Responses due
- Oct 27, 2026, 1:00 PM ET
- Posted on SAM.gov
- Oct 8, 2026
- NAICS
- 334413 · Semiconductor and Related Device Manufacturing
- Product/service code
- 5962
- Set-aside
- No Set aside used
- Place of performance
- PA, 18466
- Contracting contact
- Mark Buonomo
mark.buonomo2.civ@army.mil
5706159781
Read the official notice description
The U.S. Army Contracting Command (ACC) is issuing this Request for Information (RFI) as market research to identify qualified Original Component Manufacturers (OCMs) and their Tier-1 direct distributors (directly working with manufacturer) capable of supplying commercial-off-the-shelf (COTS), industrial, and defense-grade microelectronics in sustained, large-scale production volumes for Circuit Card Assembly (CCA) integration. The primary objective is to transition from spot-market, broker-dependent, and decentralized procurement models toward resilient, long-term, direct-tier relationships with primary component fabricators and direct suppliers. The Government seeks insights into volume production capacity, minimum lead times, wafer/die allocations, packaging assurances, and transparent chain-of-custody protocols. Disclaimer: This RFI is published solely for information and planning purposes. It does not constitute a Request for Proposal (RFP), Invitation for Bid (IFB), or an obligation on the part of the Government to acquire any products or services. The Government will not reimburse respondents for any costs incurred in preparing responses. See Attachment 1 - Request for Information for a full description of the Government's requirement for High-Volume Microelectronics Sourcing: Direct Manufacturer & Tier-1 Production Supply Chains.
Source: SAM.gov contract opportunities data (U.S. federal public data).
Incumbent
No incumbent history found for this requirement. The notice does not cite a current contract, and no earlier award from this buying office matches it.
Market context
Awards in the same category (Semiconductor and Related Device Manufacturing). This is not this requirement's award history.
Recent similar awards: Department of Defense, NAICS 334413, performed in PA
| Vendor and award | Value | Ends |
|---|---|---|
| GENTEX CORPORATIONFA860625FB003 · AIRCREW LASER EYE PROTECTION, DAY/NIGHT BALLISTIC SPECTACLES DELIVERY ORDER | $1.7M | Dec 30, 2027 |
| GENTEX CORPORATIONFA860624FB004 · AIRCREW LASER EYE PROTECTION (ALEP) NIGHT SPECTACLES DELIVERY ORDER | $10.0M | Jun 11, 2027 |
| KAMPI COMPONENTS CO INCSPE7M026V0902 · 8511760031!REGULATOR,VOLTAGE | $73,209 | Mar 29, 2027 |
| GE ENERGY POWER CONVERSION USA INC.N0010425PJC53 · MODULE,MACHINE BRID | $1.5M | Feb 16, 2027 |
| JA MOODY LLCSPE7M126V008Z · 8512185256!TRANSFORMER ASSEMBL | $46,308 | Jan 26, 2027 |
Top vendors in this category: Department of Defense, NAICS 334413, since Oct 1, 2024
5,306 contract awards in this NAICS over the period.
- 1. GLOBALFOUNDRIES U.S. 2 LLC$169.6M
- 2. BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.$16.4M
- 3. GENTEX CORPORATION$10.3M
- 4. MICROCHIP TECHNOLOGY INC$5.0M
- 5. LINTECH COMPONENTS CO. INC.$4.5M
Source: USAspending.gov federal award data (U.S. federal public data). A contract is called the incumbent only when the notice or its documents cite it by number.
Verify important details
Document checkConfirm submission instructions and amendments with the issuing agency before responding.
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