Atomic Layer Deposition System

The University of Missouri requires an atomic layer deposition system for undergraduate cleanroom courses in Columbia, Missouri. The scope includes providing a thermal and remote plasma PEALD system equipped with a load lock, six precursor sources, heated precursor bubblers, delivery lines, H2O oxidant, and O2 plasma. The system must support substrate coupon pieces from 1cm x 1cm through 6-inch wafers, reach wafer temperatures from room temperature to 400°C or higher, and include initial process recipes for Al2O3, HfO2, SiO2, TiO2, TiN, and AlN. Eligibility is limited to onshore U.S. organizations, with preference given to Missouri firms. All questions must be submitted no later than October 27, 2026, and digital responses can be submitted via email or online. The contract period will run for two years, and the buyer is actively seeking proposals to determine the budget.