Plasma Enhanced Chemical Vapor Deposition System

The buyer requires a vendor to supply a plasma enhanced chemical vapor deposition system to its location in Columbia, MO. The vendor must provide a system capable of processing substrates ranging from 1 cm x 1 cm pieces to 6-inch diameter wafers. The equipment must deposit silicon dioxide and silicon nitride films, operate on 208 VAC, and feature a temperature-controlled substrate, a temperature-controlled upper electrode, and an endpoint detection system. The buyer restricts eligibility to onshore USA organizations only and specifies that performance of the work will occur offsite. The buyer is looking for proposals regarding the budget. Vendors must submit all questions no later than September 24, 2026.